Weisheng Xia: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

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Статті (103)
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Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement

Xia, Weisheng, Xiao, Ming, Chen, Yihao, Wu, Fengshun, Liu, Zhe, Fu, Hongzhi

Журнал:

Soldering & Surface Mount Technology

Рік:

2014

Мова:

english

Файл:

PDF, 537 KB

english, 2014

Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration

Xiao, Ming, Munief, Walid Madhat, Wu, Fengshun, Lilischkis, Rainer, Oberbillig, Tobias, Saumer, Monika, Xia, Weisheng

Журнал:

Soldering & Surface Mount Technology

Рік:

2016

Мова:

english

Файл:

PDF, 602 KB

english, 2016

Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects

He, Man, Wang, Bo, Xia, weisheng, Chen, Shijie, Zhu, Jinzhuan

Журнал:

Soldering & Surface Mount Technology

Рік:

2017

Мова:

english

Файл:

PDF, 3.66 MB

english, 2017

A Comprehensive Review on the Development of Sustainable Energy Strategy and Implementation in China

Xia Yang, Yonghua Song, Guanghui Wang, Weisheng Wang

Журнал:

IEEE Transactions on Sustainable Energy

Рік:

2010

Мова:

english

Файл:

PDF, 574 KB

english, 2010

A highly stable low-RIN hybrid Brillouin/erbium amplified laser source

L. Yi, Li Zhan, Weisheng Hu, Peigang Hu, Y. Su, Lufeng Leng, Yuxing Xia

Журнал:

IEEE Photonics Technology Letters

Рік:

2006

Мова:

english

Файл:

PDF, 146 KB

english, 2006

Delay of Broadband Signals Using Slow Light in Stimulated Brillouin Scattering With Phase-Modulated Pump

Yi, L., Li Zhan, Weisheng Hu, Yuxing Xia

Журнал:

IEEE Photonics Technology Letters

Рік:

2007

Мова:

english

Файл:

PDF, 434 KB

english, 2007

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Preparation, microstructure and properties of Sn-Ag-Cu solder reinforced with Al2O3 nanoparticles

Huang, Bomin, Chen, Guang, Wu, Fengshun, Xia, Weisheng, Mo, Liping, Liu, Hui

Рік:

2014

Мова:

english

Файл:

PDF, 571 KB

english, 2014

[IEEE ICC 2014 - 2014 IEEE International Conference on Communications - Sydney, Australia (2014.6.10-2014.6.14)] 2014 IEEE International Conference on Communications (ICC) - Perfect match model based link assignment for optical satellite network

Liu, Zhe, Guo, Wei, Deng, Changlin, Hu, Weisheng, Chen, He, Zhao, Yanbin, Xia, Ming

Рік:

2014

Мова:

english

Файл:

PDF, 517 KB

english, 2014

Coherent Comb Generation With Continuous Sweep of Repetition Rate Over One-Octave

Xie, Weilin, Zhou, Qian, Zhang, Chao, Xia, Zongyang, Shi, Hongxiao, Dong, Yi, Yi, Lilin, Hu, Weisheng

Журнал:

IEEE Photonics Technology Letters

Рік:

2013

Мова:

english

Файл:

PDF, 584 KB

english, 2013

Compensation of phase error in optical frequency-domain reflectometry using delay-matched sampling

Zhou, Qian, Xie, Weilin, Xia, Zongyang, Shi, Hongxiao, Dong, Yi, Hu, Weisheng

Журнал:

Optical Engineering

Рік:

2014

Мова:

english

Файл:

PDF, 1.46 MB

english, 2014

Photonic generation of linearly chirped millimeter wave based on comb-spacing tunable optical frequency comb

Xia, Zongyang, Xie, Weilin, Sun, Dongning, Shi, Hongxiao, Dong, Yi, Hu, Weisheng

Журнал:

Optical Engineering

Рік:

2013

Мова:

english

Файл:

PDF, 1.33 MB

english, 2013

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights

Wang, Bo, Wu, Fengshun, Wu, Yiping, Mo, Liping, Xia, Weisheng

Журнал:

Soldering & Surface Mount Technology

Рік:

2011

Мова:

english

Файл:

PDF, 270 KB

english, 2011

Time Delay Concealment in Feedback Chaotic Systems With Dispersion in Loop

Ke, Junxiang, Yi, Lilin, Hou, Tongtong, Hu, Ye, Xia, Guangqiong, Hu, Weisheng

Журнал:

IEEE Photonics Journal

Рік:

2017

Мова:

english

Файл:

PDF, 829 KB

english, 2017

Effect of Age-Hardening Treatment on Microstructure and Sliding Wear-Resistance Performance of WC/Cu-Ni-Mn Composite Coatings

Liu, Jun, Yang, Shuai, Liu, Kai, Gui, Chibin, Xia, Weisheng

Журнал:

Metallurgical and Materials Transactions A

Рік:

2017

Мова:

english

Файл:

PDF, 3.46 MB

english, 2017

Image Caption Generation with Part of Speech Guidance

He, Xinwei, Shi, Baoguang, Bai, Xiang, Xia, Gui-Song, Zhang, Zhaoxiang, Dong, Weisheng

Журнал:

Pattern Recognition Letters

Рік:

2017

Мова:

english

Файл:

PDF, 3.86 MB

english, 2017

Controllable transport of a skyrmion in a ferromagnetic narrow channel with voltage-controlled magnetic anisotropy

Wang, Junlin, Xia, Jing, Zhang, Xichao, Zhao, Guo-Ping, Ye, Lei, Wu, Jing, Xu, Y B, ZHAO, Weisheng, Zou, Zhigang, Zhou, Yan

Журнал:

Journal of Physics D Applied Physics

Рік:

2018

Мова:

english

Файл:

PDF, 4.59 MB

english, 2018

Dynamics of Magnetic Skyrmion Clusters Driven by Spin-Polarized Current With a Spatially Varied Polarization

Jiang, Wenjing, Xia, Jing, Zhang, Xichao, Song, Yifan, Ma, Chuang, Fangohr, Hans, Zhao, Guoping, Liu, Xiaoxi, Zhao, Weisheng, Zhou, Yan

Журнал:

IEEE Magnetics Letters

Рік:

2018

Мова:

english

Файл:

PDF, 804 KB

english, 2018

Chaotic optical communications over 100-km fiber transmission at 30-Gb/s bit rate

Ke, Junxiang, Yi, Lilin, Xia, Guangqiong, Hu, Weisheng

Журнал:

Optics Letters

Рік:

2018

Мова:

english

Файл:

PDF, 1.95 MB

english, 2018

Analysing thermal-hydraulic performance and energy efficiency of shell-and-tube heat exchangers with longitudinal flow based on experiment and numerical simulation

Li, Nianqi, Chen, Jian, Cheng, Tao, KlemeÅ¡, JiÅÃ JaromÃr, Varbanov, Petar Sabev, Wang, Qiuwang, Yang, Weisheng, Liu, Xia, Zeng, Min

Журнал:

Energy

Рік:

2020

Файл:

PDF, 1.85 MB

2020

Withanolide Compounds from the Flower of Datura metel L.

Bingyou Yang, Qiuhong Wang, Yonggang Xia, Weisheng Feng, Haixue Kuang

Журнал:

Helvetica Chimica Acta

Рік:

2007

Мова:

english

Файл:

PDF, 81 KB

english, 2007

Baimantuoluolines D – F, Three New Withanolides from the Flower of Datura metel L.

Bingyou Yang, Qiuhong Wang, Yonggang Xia, Weisheng Feng, Haixue Kuang

Журнал:

Helvetica Chimica Acta

Рік:

2008

Мова:

english

Файл:

PDF, 189 KB

english, 2008

A novel integrated temperature investigation approach of sprayed coatings during APS process

Weisheng Xia, Haiou Zhang, Guilan Wang, Yunzhen Yang

Журнал:

Journal of Materials Processing Technology

Рік:

2009

Мова:

english

Файл:

PDF, 503 KB

english, 2009

3-D model of thermo-fluid and electrochemical for planar SOFC

Guilan Wang, Yunzhen Yang, Haiou Zhang, Weisheng Xia

Журнал:

Journal of Power Sources

Рік:

2007

Мова:

english

Файл:

PDF, 991 KB

english, 2007

Computational analysis of thermo-fluid and electrochemical characteristics of MOLB-type SOFC stacks

Yunzhen Yang, Guilan Wang, Haiou Zhang, Weisheng Xia

Журнал:

Journal of Power Sources

Рік:

2007

Мова:

english

Файл:

PDF, 828 KB

english, 2007

Effects of operations and structural parameters on the one-cell stack performance of planar solid oxide fuel cell

Weisheng Xia, Yunzhen Yang, Qiusheng Wang

Журнал:

Journal of Power Sources

Рік:

2009

Мова:

english

Файл:

PDF, 2.52 MB

english, 2009

On the relationship between environmental aridization of the Loess Plateau and soil water in loess

Wenzhi Yang, Ming’an Shao, Xinde Peng, Weisheng Xia

Журнал:

SCIENCE CHINA Earth Sciences

Рік:

1999

Мова:

english

Файл:

PDF, 648 KB

english, 1999

An Integrated Investigation Approach for Coating Temperature Measurement and Control During Plasma Spraying

Haiou Zhang, Weisheng Xia, Guilan Wang, Yunzhen Yang, Yang Zou

Журнал:

Journal of Thermal Spray Technology

Рік:

2008

Мова:

english

Файл:

PDF, 511 KB

english, 2008

Comparison of heat and mass transfer between planar and MOLB-type SOFCs

Yunzhen Yang, Guilan Wang, Haiou Zhang, Weisheng Xia

Журнал:

Journal of Power Sources

Рік:

2008

Мова:

english

Файл:

PDF, 1.04 MB

english, 2008

New megastigmane sesquiterpene and indole alkaloid glucosides from the aerial parts of Bupleurum chinense DC.

Haixue Kuang, Shiwei Sun, Bingyou Yang, Yonggang Xia, Weisheng Feng

Журнал:

Fitoterapia

Рік:

2009

Мова:

english

Файл:

PDF, 308 KB

english, 2009

Tunable gain-clamped double-pass Erbium-doped fiber amplifier

Yi, Lilin, Zhan, Li, Hu, Weisheng, Tang, Qianxin, Xia, Yuxing

Журнал:

Optics Express

Рік:

2006

Мова:

english

Файл:

PDF, 68 KB

english, 2006

Method for measuring velocity of shallow water flow for soil erosion with an electrolyte tracer

Lei Tingwu, Weisheng Xia, Jun Zhao, Zhen Liu, Qingwen Zhang

Журнал:

Journal of Hydrology

Рік:

2005

Мова:

english

Файл:

PDF, 200 KB

english, 2005

Abnormal infrasound signals before 92 M ≧ 7.0 worldwide earthquakes during 2002–2008

Yaqin Xia, Jann-Yenq Tiger Liu, Xiaoyan Cui, Junzhi Li, Weisheng Chen, Chengyan Liu

Журнал:

Journal of Asian Earth Sciences

Рік:

2011

Мова:

english

Файл:

PDF, 1.47 MB

english, 2011

Sliding scheduled lightpath provisioning by mixed partition coloring in WDM optical networks

Zhe Liu, Wei Guo, Qingqi Shi, Weisheng Hu, Ming Xia

Журнал:

Optical Switching and Networking

Рік:

2013

Мова:

english

Файл:

PDF, 894 KB

english, 2013

Balance of Power: Toward a More Environmentally Friendly, Efficient, and Effective Integration of Energy Systems in China

Chongqing Kang,, Xinyu Chen,, Qianyao Xu,, Dongming Ren,, Yuehui Huang,, Qing Xia,, Weisheng Wang,, Changming Jiang,, Ji Liang,, Jianbo Xin,, Xu Chen,, Bo Peng,, Kun Men,, Zheng Chen,, X

Журнал:

IEEE Power and Energy Magazine

Рік:

2013

Мова:

english

Файл:

PDF, 3.30 MB

english, 2013

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications

Lin, Huang, Liangjie, Zhou, Hui, Liu, Fengshun, Wu, Weisheng, Xia, Hongzhi, Fu, Shiyu, Wang, Zhe, Liu

Рік:

2013

Мова:

english

Файл:

PDF, 406 KB

english, 2013

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints

Liangjie, Zhou, Lin, Huang, Fengshun, Wu, Hui, Liu, Weisheng, Xia, Hongzhi, Fu, Shiyu, Wang, Zhe, Liu

Рік:

2013

Мова:

english

Файл:

PDF, 577 KB

english, 2013

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder

Xu, Kaisheng, Chen, Guang, Wu, Fengshun, Xia, Weisheng, Liu, Hui

Рік:

2014

Мова:

english

Файл:

PDF, 592 KB

english, 2014

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Research on dimensional change characteristics of silver halide films for multi-layer PCBs

Zhou, Liangjie, Peng, Weihong, Liu, Dong, Zou, Rubin, Jiang, Xuefei, Xia, Weisheng, Wu, Fengshun

Рік:

2011

Мова:

english

Файл:

PDF, 1.50 MB

english, 2011

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of Ni-coated graphene on the performance of SAC305 solder

Chen, Guang, Wu, Fengshun, Xia, Weisheng, Liu, Hui, Liu, Changqing

Рік:

2014

Мова:

english

Файл:

PDF, 852 KB

english, 2014

Energy-efficient Dynamic Bandwidth Allocation for EPON networks with sleep mode ONUs

Li, Chengjun, Guo, Wei, Hu, Weisheng, Xia, Ming

Журнал:

Optical Switching and Networking

Рік:

2015

Мова:

english

Файл:

PDF, 843 KB

english, 2015

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - The size dependency of full IMC solder joint for 3D interconnection

Mo, Liping, Wu, Fengshun, Liu, Changqing, Xia, Weisheng

Рік:

2012

Мова:

english

Файл:

PDF, 1.02 MB

english, 2012

[IEEE 2006 32nd European Conference on Optical Communications - (ECOC 2006) - Cannes, France (2009.09.24-2006.09.28)] 2006 European Conference on Optical Communications - Delay of RZ PRBS Data Based on Wide-Band SBS by Phase-Modulating the Brillouin Pump

Yi, Lilin, Zhan, Li, Su, Yikai, Hu, Weisheng, Leng, Lufeng, Song, Yuejiang, Shen, Haigen, Xia, Yuxing

Рік:

2006

Мова:

english

Файл:

PDF, 2.20 MB

english, 2006

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array

Chen, Shijie, Wu, Fengshun, Xia, Weisheng, Liu, Hui, Xiao, Ming, Huang, Lin

Рік:

2014

Мова:

english

Файл:

PDF, 799 KB

english, 2014

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Effect of interface structure on fatigue life under thermal cycle with SAC305 solder joints

Yanjun, Xu, Liquan, Wang, Fengshun, Wu, Weisheng, Xia, Hui, Liu

Рік:

2013

Мова:

english

Файл:

PDF, 658 KB

english, 2013

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Electric-thermo-mechanical analysis of TSV under high current stressing

Xiao, Ming, Wu, Fengshun, Liu, Hui, Xia, Weisheng

Рік:

2013

Мова:

english

Файл:

PDF, 688 KB

english, 2013

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Simulation of temperature fields for Cu/Cu joining process by self-propagating reaction

Wang, Baihui, Zhu, Wenbo, Xia, Weisheng, Liu, Hui, Wu, Fengshun

Рік:

2013

Мова:

english

Файл:

PDF, 641 KB

english, 2013

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Electromigration — Induced failure mechanism and lifetime prediction in NiCu thin film

Xu, Yanjun, Huang, Lin, Chen, Guang, Wu, Fengshun, Xia, Weisheng, Liu, Hui

Рік:

2014

Мова:

english

Файл:

PDF, 721 KB

english, 2014

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Solder behavior and defect formation in joining process by Al/Ni self-propagating reaction

Zhu, Wenbo, Wu, Fengshun, Xia, Weisheng, Wang, Baihui, Wang, Paul, Hou, Eric

Рік:

2013

Мова:

english

Файл:

PDF, 895 KB

english, 2013

Membrane fouling of hybrid submerged membrane bioreactor (hMBR) in treating municipal wastewater

Guo, Jifeng, Guan, Weisheng, Xia, Siqing

Журнал:

DESALINATION AND WATER TREATMENT

Рік:

2014

Мова:

english

Файл:

PDF, 487 KB

english, 2014

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of heat sink on electromigration lifetime of Ni thin film

Huang, Lin, Chen, Shijie, Wu, Fengshun, Xia, Weisheng, Liu, Hui, Xu, Yanjun

Рік:

2014

Мова:

english

Файл:

PDF, 538 KB

english, 2014